Peeling in Bimaterial Beams: The Peeling Moment and Its Relation to the Differential Rigidity

[+] Author and Article Information
Thomas D. Moore

Analog Devices B.V., Raheen Business Park, Limerick, IrelandThermomechanical Solutions, Limerick, Ireland e-mail: tmoore@thermomechanical.com

John L. Jarvis

Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Ireland e-mail: john.jarvis@ul.ie

J. Appl. Mech 71(2), 290-292 (May 05, 2004) (3 pages) doi:10.1115/1.1651092 History: Received April 21, 2003; Revised September 19, 2003; Online May 05, 2004
Copyright © 2004 by ASME
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Moore,  T. D., and Jarvis,  J. L., 2003, “A Simple and Fundamental Design Rule for Resisting Delamination in Bimaterial Structures,” Microelectron. Reliab., 43(3), pp. 487–494.
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Suhir,  E., 1986, “Stresses in Bi-metal Thermostats,” ASME J. Appl. Mech., 53, pp. 657–660.
Suhir,  E., 1989, “Interfacial Stresses in Bi-metal Thermostats,” ASME J. Appl. Mech., 56, pp. 595–600.
Ru,  C. Q., 2002, “Interfacial Thermal Stresses in Bimaterial Beams: Modified Beam Models Revisited,” ASME J. Electron. Packag., 124, pp. 141–146.
Moore,  T. D., and Jarvis,  J. L., 2001, “Failure Analysis and Stress Simulation in Small Multichip BGAs,” IEEE Trans. Adv. Packag., 24(2), pp. 216–223.


Grahic Jump Location
Effect on μ and pmax of varying upper layer thickness
Grahic Jump Location
Tensile and compressive action of each layer on the other in a bimaterial beam due to a uniform change in temperature
Grahic Jump Location
Loads on a representative segment of a bimaterial beam remote from the ends (from Fig. 1 of Ref. 2)




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