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TECHNICAL PAPERS

A Cracked Piezoelectric Material Strip Under Transient Thermal Loading

[+] Author and Article Information
B. L. Wang, Y. W. Mai

Department of Manufacturing Engineering and Engineering Management, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong

J. Appl. Mech 69(4), 539-546 (Jun 20, 2002) (8 pages) doi:10.1115/1.1429935 History: Received October 18, 2000; Revised July 13, 2001; Online June 20, 2002
Copyright © 2002 by ASME
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References

Rizk,  A. A., and Radwan,  S. F., 1992, “Transient Thermal Stress Problem for a Cracked Semi-infinite Medium,” J. Therm. Stresses, 15, pp. 451–468.
Rizk,  A. A., and Radwan,  S. F., 1993, “Fracture of a Plate Under Transient Thermal Stresses,” J. Therm. Stresses, 16, pp. 79–102.
Rizk,  A. A., and Erdogan,  F., 1989, “Cracking of Coated Materials Under Transient Thermal Stresses,” J. Therm. Stresses, 12, pp. 125–168.
Erdogan,  F., and Wu,  B. H., 1996, “Crack Problem in FGM Layers Under Thermal Stresses,” J. Therm. Stresses, 19, pp. 237–265.
Noda,  N., 1997, “Thermal Stresses Intensity Factor for Functionally Gradient Plate With an Edge Crack,” J. Therm. Stresses, 20, pp. 373–387.
Shindo,  Y., Watanabe,  K., and Narita,  F., 2000, “Electroelastic Analysis of a Piezoelectric Ceramic Strip With a Central Crack,” Int. J. Eng. Sci., 38, pp. 1–19.
Wang,  T. C., 2000, “Analysis of Strip Electric Saturation Model of Crack Problem in Piezoelectric Materials,” Int. J. Solids Struct., 37, pp. 6031–6049.
Chao,  L.-P., and Huang,  J. H., 2000, “On a Piezoelectric Material Containing a Permeable Elliptical Crack,” Int. J. Solids Struct., 37, pp. 5161–5176.
Pak,  Y. E., 1990, “Crack Extension Force in a Piezoelectric Material,” J. Appl. Mech., 57, pp. 647–653.
Kwon,  S. M., and Lee,  K. Y., 2000, “Analysis of Stress and Electric Fields in a Rectangular Piezoelectric Body With a Center Crack Under Anti-plane Shear Loading,” Int. J. Solids Struct., 37, pp. 4859–4869.
Lee,  K. Y., Lee,  W. G., and Pak,  Y. E., 2000, “Interaction Between a Semi-infinite Crack and a Screw Dislocation in a Piezoelectric Material,” ASME J. Appl. Mech., 67, pp. 165–170.
Calderon-Moreno,  J. M., 2001, “Stress Induce Domain Switching of PZT in Compression Tests,” Mater. Sci. Eng., Ser. A., 315, pp. 227–230.
Wang,  B. L., and Noda,  N., 2000, “Mixed Mode Crack Initiation in Piezoelectric Ceramic Strip,” Theor. Appl. Fract. Mech., 34, pp. 34–47.
Lu,  P., Tan,  M. J., and Liew,  K. M., 1998, “Piezothermoelastic Analysis of a Piezoelectric Material With an Elliptic Cavity Under Uniform Heat Flow,” Arch. Appl. Mech., 68, pp. 719–733.
Gradshteyn, I. S., and Ryzhik, I. M., eds., 1980, Tables of Integral, Series, and Products, Academic Press, San Diego, CA, p. 406.

Figures

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A piezoelectric material strip with a crack (a=(c−b)/2), if b is larger than zero the crack is embedded in the strip, whereas b equals zero corresponds to an edge crack problem.
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Transient temperature distributions for different boundary conditions (B, C)
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Transient thermal stresses distributions in an uncracked strip
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Transient thermal stresses distribution in an uncracked strip (continued)
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Transient thermal stresses against time for different position
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Transient thermal stress intensity factors K(b) at the embedded crack tip for different crack length (b+c=h)
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Transient thermal stress intensity factors K(c) at the embedded crack tip for different crack length (b+c=h)
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Peak values of the thermal stress intensity factor at the embedded crack tips for different crack length (b+c=h)
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Transient thermal stress intensity factors against time for the edge crack problem
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Transient thermal stress intensity factors with crack length for the edge crack problem
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Peak values of the thermal stress intensity factor for the edge crack problem

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