Research Papers

Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design

[+] Author and Article Information
E. Suhir

 University of California, Santa Cruz, CA 95064;  University of Maryland, College Park, MD 20740;  Technical University, Vienna 1097, Austria;  Bell Laboratories, Murray Hill, NJ 07974

C. Gu

 University of California, Santa Cruz, CA 95064

L. Cao

 Tsinghua University, Beijing, China

J. Appl. Mech 79(1), 011011 (Dec 13, 2011) (6 pages) doi:10.1115/1.4005192 History: Received May 06, 2011; Revised August 25, 2011; Published December 13, 2011; Online December 13, 2011

A simple, easy-to-apply and physically meaningful analytical (“mathematical”) stress model is developed for the prediction of the thermally induced stresses in a circular adhesively bonded assembly with identical adherends. The assembly is fabricated at an elevated temperature and is subsequently cooled down to a lower temperature. The developed model can be helpful for stress-strain analyses and physical design of electronic and photonic assemblies of the type in question, and particularly those employed in holographic memory systems.

Copyright © 2012 by American Society of Mechanical Engineers
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