Research Papers

Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier

[+] Author and Article Information
E. Suhir

 Physical Science and Engineering Research Division, Bell Laboratories, Murray Hill, NJ 79074 (ret.)  University of California, Santa Cruz, CA 95064  University of Maryland, College Park, MD 20742  Technical University, Vienna, Austria ERS Corporation, 727 Alvina Court, Los Altos, CA 94024

J. Appl. Mech 79(1), 011010 (Dec 13, 2011) (7 pages) doi:10.1115/1.4005191 History: Received March 28, 2011; Revised August 25, 2011; Published December 13, 2011; Online December 13, 2011

A die-carrier assembly, subjected to the external tensile forces and bending moments applied to the flexible carrier is considered. The objective of the analysis is to develop a simple, easy-to-use, and physically meaningful predictive analytical (“mathematical”) model aimed at understanding the physics of the combined action of tension and bending experienced by the carrier and transmitted to the die through the more-or-less compliant bond. The addressed stresses include the interfacial shearing and peeling stresses, as well as the normal stress acting in the cross sections of the die. The obtained formulae can be used in the analysis and design of assemblies of the type in question.

Copyright © 2012 by American Society of Mechanical Engineers
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Figure 1

Die-carrier assembly subjected to the combined action of tensile forces (a) and to bending moments (b) applied to the carrier: the carrier (component 1) experiences direct action of both the external tensile forces and the bending moments, whereas the die (component 2) is loaded by the distributed shearing and peeling forces transmitted through the bonding layer. Although the tensile forces and the bending moments are shown separately in (a) and (b), it is presumed that they are applied simultaneously to the component 1 ends. The indicated directions of the forces are considered positive. Note that the tensile force in (a) and the bending moment in (b) that are applied clockwise increase the interfacial stress and should be summed up when the interfacial shearing stress is evaluated. Because the tensile force provides a bending moment (with respect to the interface) that acts in the counterclockwise direction, the moment provided by the tensile force T∧ should be subtracted from the moment caused by the external moment M∧.




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