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Research Papers

Thermal Weight Functions and Stress Intensity Factors for Bonded Dissimilar Media Using Body Analogy

[+] Author and Article Information
Ratnesh Khandelwal1

 Research Engineer, GE India Technology Centre Pvt. Ltd., Whitefield Road, Bangalore, India 560066ratneshk@gmail.com

J. M. Chandra Kishen2

Associate Professor, Department of Civil Engineering,  Indian Institute of Science, Bangalore, 560 012, Indiachandrak@civil.iisc.ernet.in

1

Formerly Graduate Student, Dept. of Civil Engineering, Indian Institute of Science, Bangalore, 560012, India.

2

Corresponding author.

J. Appl. Mech 78(6), 061019 (Sep 09, 2011) (9 pages) doi:10.1115/1.4003911 History: Received July 15, 2010; Accepted March 24, 2011; Posted April 04, 2011; Published September 09, 2011; Online September 09, 2011

In this study, an analytical method is presented for the computation of thermal weight functions in two dimensional bi-material elastic bodies containing a crack at the interface and subjected to thermal loads using body analogy method. The thermal weight functions are derived for two problems of infinite bonded dissimilar media, one with a semi-infinite crack and the other with a finite crack along the interface. The derived thermal weight functions are shown to reduce to the already known expressions of thermal weight functions available in the literature for the respective homogeneous elastic body. Using these thermal weight functions, the stress intensity factors are computed for the above interface crack problems when subjected to an instantaneous heat source.

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Copyright © 2011 by American Society of Mechanical Engineers
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Figures

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Figure 1

Geometrically similar bodies

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Figure 2

Analogous bodies

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Figure 3

Semi-infinite crack subjected to impulse heat source at (xo,yo)

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Figure 4

Semi-infinite crack subjected to point loads on crack surface

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Figure 5

Finite crack subjected to impulse heat source at (xo,yo)

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Figure 6

Finite crack in an infinite body subjected to far field stresses

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Figure 7

Position of heat source relative to crack tip for finite (left) and infinite (right) crack

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Figure 8

Transient normalized Mode 1 stress intensity factor for a semi-infinite bimaterial interface crack due to thermal impulse

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Figure 9

Transient normalized Mode 1 stress intensity factor for a finite bimaterial interface crack due to thermal impulse

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