0
TECHNICAL PAPERS

Progressive Cracking of a Multilayer System Upon Thermal Cycling

[+] Author and Article Information
M. R. Begley

Department of Civil Engineering, University of Virginia, Charlottesville, VA 22904 e-mail: begley@virginia.edu

A. G. Evans

Materials Institute, Princeton University, Princeton, NJ 08540

J. Appl. Mech 68(4), 513-520 (Nov 07, 2000) (8 pages) doi:10.1115/1.1379529 History: Received December 22, 1999; Revised November 07, 2000
Copyright © 2001 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Bree diagrams for a metal-matrix composite (left) and a two-bar model used for studying pressure vessels (right), illustrating the relationship between thermal loading, applied tensile loading, and regions of ratcheting and shakedown
Grahic Jump Location
Modified Bree diagram for a trilayer: (a) for moderate values of mean stress in the dielectric, (b) for high levels of mean stress in the dielectric
Grahic Jump Location
Crack opening as a function of initial stress in the dielectric layer, for two scenarios. Because of the small difference in thermal expansion between the dielectric and substrate, the mean stress in the dielectric remains close to the initial value.
Grahic Jump Location
Fractional increase in crack opening from the first thermal cycle to the tenth thermal cycle, plotted as a function of total stress amplitude range in the metal layer
Grahic Jump Location
Crack-opening (or upper bound estimate of the energy release rate) as a function of time (or thermal cycles) for representative cases outlined in Table 2
Grahic Jump Location
Crack-opening displacements at the surface of the dielectric as a function of time (or thermal cycles) for two representative cases; the cases are the same as those labeled in Fig. 7 and described in Table 2
Grahic Jump Location
Crack-opening as a function of stress in the metal layer for several values of stress in the dielectric (monotonic loading). The stress ratio during the loading stage (ΣR) is dictated by the ratio of Σ1 and Σ2.
Grahic Jump Location
(a) Crack-opening as a function of stress in the dielectric (monotonic loading), for constant ratios of stress in the metal layer to stress in the dielectric. The result is also an upper bound estimate for the energy release rate. (b) Crack-opening (or upper bound estimate of the energy release rate) as a function of stress in the metal layer (monotonic loading), for constant ratios of stress in the metal layer to stress in the dielectric.
Grahic Jump Location
Schematic of tri-layer system used to define the finite element model
Grahic Jump Location
Schematic of a channeling crack in a multilayer deposited on an elastic substrate. The middle layer represents an elastic-plastic interconnect, while the top layer is representative of an elastic dielectric; N is the number of thermal cycles.

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In