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TECHNICAL PAPERS

Three-Dimensional Solutions of Smart Functionally Graded Plates

[+] Author and Article Information
J. N. Reddy, Z.-Q. Cheng

Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123

J. Appl. Mech 68(2), 234-241 (May 02, 2000) (8 pages) doi:10.1115/1.1347994 History: Received December 06, 1999; Revised May 02, 2000
Copyright © 2001 by ASME
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References

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Figures

Grahic Jump Location
Geometry of a smart FG plate
Grahic Jump Location
Through-the-thickness distribution of the ceramic phase in the FG plate
Grahic Jump Location
Through-the-thickness distribution of the dimensionless displacement ū1 of the plate (a/b=1,n=0.5, 1, 2) under (I) the thermal load T+, (II) the mechanical load q3+, and (III) the electric load −V: (a) a/h=10; (b) a/h=4
Grahic Jump Location
Through-the-thickness distribution of the dimensionless deflection ū3 of the plate (a/b=1,n=0.5, 1, 2) under (I) the thermal load T+, (II) the mechanical load q3+, and (III) the electric load −V: (a) a/h=10; (b) a/h=4
Grahic Jump Location
Through-the-thickness distribution of the dimensionless longitudinal stress σ̄11 of the plate under (I) the thermal load T+, (II) the mechanical load q3+, and (III) the electric load −V (a/b=1,a/h=4,n=1)
Grahic Jump Location
Through-the-thickness distribution of the dimensionless longitudinal stress σ̄12 of the plate under (I) the thermal load T+, (II) the mechanical load q3+, and (III) the electric load −V (a/b=1,a/h=4,n=1)
Grahic Jump Location
Through-the-thickness distribution of the dimensionless transverse shear stress σ̄13 of the plate under (I) the thermal load T+, (II) the mechanical load q3+, and (III) the electric load −V (a/b=1,a/h=4,n=1)
Grahic Jump Location
Through-the-thickness distribution of the dimensionless transverse normal stress σ̄33 of the plate under (I) the thermal load T+, (II) the mechanical load q3+, and (III) the electric load −V (a/b=1,a/h=4,n=1)

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