0
TECHNICAL PAPERS

Predicted Thermal Mismatch Stresses in a Cylindrical Bi-material Assembly Adhesively Bonded at Its Ends

[+] Author and Article Information
E. Suhir

Bell Laboratories, 600 Mountain Avenue, Room ID-443, Murray Hill, NJ 07974

J. Appl. Mech 64(1), 15-22 (Mar 01, 1997) (8 pages) doi:10.1115/1.2787268 History: Received December 18, 1995; Revised May 15, 1996; Online October 25, 2007

Abstract

A simple analytical stress model, based on the strength-of-materials approach, is developed for the evaluation of thermally induced shearing stresses in a long cylindrical bi-material assembly adhesively bonded at its ends and subjected to the change in temperature. The emphasis is on the interaction of the “global” thermal mismatch stresses, counted with respect to the mid cross section of the assembly as a whole, and the “local” stresses, counted with respect to the mid cross sections of the bonded regions. The effect of the coefficient of thermal expansion of the adhesive material itself is also considered. We show also how to evaluate the fundamental frequency of vibrations of the inner cylinder with consideration of the thermally induced tension, if any.

Copyright © 1997 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In