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TECHNICAL PAPERS

Subsonic and Intersonic Crack Growth Along a Bimaterial Interface

[+] Author and Article Information
R. P. Singh

Graduate Aeronautical Labs, 105-50, California Institute of Technology, Pasadena, CA 91101

A. Shukla

Dynamic Photomechanics Laboratory, Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island, Kingston, RI 02881

J. Appl. Mech 63(4), 919-924 (Dec 01, 1996) (6 pages) doi:10.1115/1.2787247 History: Received February 23, 1995; Revised March 16, 1996; Online October 26, 2007

Abstract

An experimental investigation has been conducted to study the dynamic failure of bimaterial interfaces. Interfacial crack growth is observed using dynamic photoelasticity and characterized in terms of crack-tip velocity, complex stress intensity factor, and energy release rate. On the basis of crack-tip velocity two growth regimes are established, viz. the subsonic and transonic regimes. In the latter regime crack-tip velocities up to 1.3 times the shear wave velocity of the more compliant material are observed. This results in the formation of a line of discontinuity in the stress field surrounding the crack tip and also the presence of a pseudo crack tip that travels with the Rayleigh wave velocity (of the more compliant material).

Copyright © 1996 by The American Society of Mechanical Engineers
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