0
BRIEF NOTES

Thermal Stresses in a Multilayered Anisotropic Medium With Interface Thermal Resistance

[+] Author and Article Information
T. C. Chen, H. I. Jang

Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C.

J. Appl. Mech 62(3), 810-811 (Sep 01, 1995) (2 pages) doi:10.1115/1.2897018 History: Received November 22, 1993; Revised October 20, 1994; Online October 30, 2007

Abstract

This note is concerned with thermoelastic analysis of a multilayered anisotropic medium under the state of generalized plane deformation with interlayer thermal contact resistance. The powerful flexibility/stiffness matrix method is adopted here to obtain the complete solution of the entire layered medium by introducing the thermal and mechanical boundary and layer interface conditions including interlayer imperfect thermal contact conditions. As a numerical illustration, the effects of interlayer thermal resistance on the distributions of temperatures and thermal stresses in a laminated anisotropic slab subjected to a uniform surface temperature rise are presented.

Copyright © 1995 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In