Thermal Stresses in a Bimaterial Joint: An Experimental Analysis

[+] Author and Article Information
D. Post, J. D. Wood, B. Han

Engineering Science and Mechanics Department, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061

V. J. Parks

Civil Engineering Department, The Catholic University of Arizona, Washington, DC 20064

F. P. Gerstle

Sandia National Laboratories, Albuquerque, NM 87185

J. Appl. Mech 61(1), 192-198 (Mar 01, 1994) (7 pages) doi:10.1115/1.2901397 History: Received February 03, 1992; Revised December 21, 1992; Online March 31, 2008


An experimental analysis was conducted on a bimaterial plate subjected to a uniform change of temperature. Whole-field displacement measurements U and V were made on the free surface by means of high-sensitivity moire interferometry, and stresses were calculated from these data. Stresses resembled those of stress singularities, but they reached finite tensile and compressive peaks on opposite sides of the interface. The peaks and a severe stress gradient between them occurred in a narrow zone of about ±25 μm from the interface. The results pertain to an elastic three-dimensional body.

Copyright © 1994 by The American Society of Mechanical Engineers
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