Stress Singularities at the Interface in Bonded Dissimilar Materials Under Mechanical and Thermal Loading

[+] Author and Article Information
D. Munz, Y. Y. Yang

Institute for Reliability and Failure Analysis, University of Karlshuhe, W-7500 Karlsruhe, Federal Republic of Germany

J. Appl. Mech 59(4), 857-861 (Dec 01, 1992) (5 pages) doi:10.1115/1.2894053 History: Received February 20, 1991; Revised December 11, 1991; Online March 31, 2008


Stress singularities occur at the free edge of the interface of bonded dissimilar materials. General relations for a compound with 90-degree angles of the two materials are given for the parameters which describe the stress field. Differences between mechanical and thermal loadings are discussed.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In