Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface

[+] Author and Article Information
Norio Hasebe

Department of Civil Engineering, Nagoya Institute of Technology, Gokisocho, Showaku, Nagoya 466, Japan

Mikiya Okumura

Tokyu Construction Co., Ltd., Sibuya 1-16-14, Sibuyaku, Tokyo 150, Japan

Takuji Nakamura

Department of Civil Engineering, Nagoya Institute of Technology Gokisocho, Showaku, Nagoya 466, Japan

J. Appl. Mech 59(1), 77-83 (Mar 01, 1992) (7 pages) doi:10.1115/1.2899467 History: Received September 21, 1989; Revised August 20, 1990; Online March 31, 2008


A problem of two bonded, dissimilar half-planes containing an elliptical hole on the interface is solved. The external load is uniform tension parallel to the interface. A rational mapping function and complex stress functions are used and an analytical solution is obtained. Stress distributions are shown. Stress concentration factors are also obtained for arbitrary lengths of debonding and for several material constants. In addition, an approximate expression of the stress concentration factor is given for elliptical holes and the accuracy is investigated.

Copyright © 1992 by The American Society of Mechanical Engineers
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