Three-Dimensional Stress Fields of Elastic Interface Cracks

[+] Author and Article Information
T. Nakamura

Department of Mechanical Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794

J. Appl. Mech 58(4), 939-946 (Dec 01, 1991) (8 pages) doi:10.1115/1.2897711 History: Received June 13, 1990; Revised November 06, 1990; Online March 31, 2008


Various aspects of stress fields near an interface crack in three-dimensional bimaterial plates are investigated. Due to the nature of the resulting deformation field, three-dimensional effects are more critical in a bimaterial plate than in a homogeneous plate. In the close vicinity of the crack front, the stress field is characterized by the asymptotic bimaterial K -field, and its domain size is a very small fraction of a plate thickness. Unlike a homogeneous case, the asymptotic field always consists all three modes of fracture, and an interface crack must propagate under mixed-mode conditions. Furthermore, computational results have shown that the two phase angles representing the relative magnitudes of the three modes strongly depend on the bimaterial properties. It has been also observed that a significant antiplane (Mode III) deformation exists along the crack front, especially near the free surface. Since experimental investigations have shown that critical energy release rate G c is highly dependent on the phase angles, accurate prediction of the interface fracture behavior requires not only the G distribution but also the variations of phase angles along the crack front.

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In