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RESEARCH PAPERS

Material Compatibility in Interfacial Transient Thermal Fracture of Ceramic-to-Metal Bonds

[+] Author and Article Information
Klod Kokini

Purdue University, School of Mechanical Engineering, West Lafayette, IN 47907

J. Appl. Mech 55(4), 767-772 (Dec 01, 1988) (6 pages) doi:10.1115/1.3173720 History: Received July 24, 1987; Revised February 15, 1988; Online July 21, 2009

Abstract

The effect of changing thermal expansion coefficients and thermal properties on the deformations and strain energy release rates of cracks at the interface between a ceramic-to-metal bond subjected to a transient thermal load is examined. The configurations of a two-dimensional edge and center through-cracks are analyzed. The effects of the thickness of the ceramic are considered. The results show that equating the thermal expansion coefficients of the two materials can lead to an increase in the strain energy release rate. A simple two-bar model is used to provide a qualitative explanation for the results.

Copyright © 1988 by ASME
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