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TECHNICAL BRIEFS

Thermoelastic Stress Due To Surface Parallelepiped Inclusions

[+] Author and Article Information
S. Lee

Department of Materials Science, National Tsing Hua University, Hsinchu, Taiwan 300, Republic of China

C. C. Hsu

Department of Physics, National Tsing Hua University, Hsinchu, Taiwan 300, Republic of China

J. Appl. Mech 52(1), 225-228 (Mar 01, 1985) (4 pages) doi:10.1115/1.3169004 History: Received March 01, 1984; Revised June 01, 1984; Online July 21, 2009

Abstract

The thermoelastic stress generated by surface parallelepiped inclusions has been solved by the Mindlin method. The stress components near the free surface and inside the solid have been discussed. Numerical results using this method are compared with Chiu’s results obtained by using the Fourier transform.

Copyright © 1985 by ASME
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