Residual Thermal Stresses Due to Cool-Down of Epoxy-Resin Composites

[+] Author and Article Information
Y. Weitsman

Civil Engineering Department, Texas A & M University, College Station, Texas 77843

J. Appl. Mech 46(3), 563-567 (Sep 01, 1979) (5 pages) doi:10.1115/1.3424606 History: Received June 01, 1978; Revised December 01, 1978; Online July 12, 2010


This paper concerns the residual thermal stresses that develop within the resin of a fiber-reinforced composite-laminate as the material is cooled from cure temperature down to room temperature. The calculations presented herein consider the viscoelastic response of the resin and account for the temperature dependence and the stress sensivitity of the creep compliance. Comparisons with linear elasticity indicate that viscoelastic relaxation may reduce the residual stresses by about 20 percent.

Copyright © 1979 by ASME
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