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RESEARCH PAPERS

Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium

[+] Author and Article Information
W. T. Chen

Systems Development Division, IBM Corporation, Endicott, N. Y.

J. Appl. Mech 34(1), 133-136 (Mar 01, 1967) (4 pages) doi:10.1115/1.3607613 History: Received January 27, 1966; Online September 14, 2011

Abstract

When a uniform heat flow in an infinite orthotropic solid is disturbed by the presence of a long circular insulated cavity, local intensification of the temperature gradient occurs in the neighborhood of the cavity. This report describes a study of the stress field induced by the temperature distribution. The linear plane (plane stress or plane strain) thermoelastic problem is solved by using the complex variable technique. The analysis may also be used for other steady-state thermal stress problems in an orthotropic medium.

Copyright © 1967 by ASME
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