Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium

[+] Author and Article Information
W. T. Chen

Systems Development Division, IBM Corporation, Endicott, N. Y.

J. Appl. Mech 34(1), 133-136 (Mar 01, 1967) (4 pages) doi:10.1115/1.3607613 History: Received January 27, 1966; Online September 14, 2011


When a uniform heat flow in an infinite orthotropic solid is disturbed by the presence of a long circular insulated cavity, local intensification of the temperature gradient occurs in the neighborhood of the cavity. This report describes a study of the stress field induced by the temperature distribution. The linear plane (plane stress or plane strain) thermoelastic problem is solved by using the complex variable technique. The analysis may also be used for other steady-state thermal stress problems in an orthotropic medium.

Copyright © 1967 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In