Photoelastic Analysis of Plates Subjected to Restrained Shrinkage

[+] Author and Article Information
V. J. Parks

Mechanics Division, The Catholic University of America, Washington, D. C.

A. J. Durelli

The Catholic University of America, Washington, D. C.

J. Appl. Mech 32(3), 504-510 (Sep 01, 1965) (7 pages) doi:10.1115/1.3627251 History: Received October 15, 1964; Revised February 01, 1965; Online September 15, 2011


Techniques have been developed to cast photoelastic materials in molds or about inserts and allow them to bond at the interfaces or remain free, at will. The birefringence associated with the restrained shrinkage developed in the process of curing can be analyzed in a polariscope. This paper deals with the stress-and-strain problems that can be studied using this method and with the interpretation to be given to the results obtained. To solve two-dimensional problems, it is suggested that a method be used to minimize the “pinching” effect or restrained shrinkage transverse to the plate plane at bonded boundaries. Applications to plates of complicated shapes with several discontinuities, with and without inserts, are shown.

Copyright © 1965 by ASME
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