Technical Brief

Mechanics Design for Buckling of Thin Ribbons on an Elastomeric Substrate Without Material Failure

[+] Author and Article Information
Ao Wang

Department of Civil and Environmental Engineering,
Northwestern University,
Evanston, IL 60208

Raudel Avila

Department of Mechanical Engineering,
Northwestern University,
Evanston, IL 60208

Yinji Ma

Department of Civil and Environmental Engineering,
Northwestern University,
Evanston, IL 60208;
Department of Engineering Mechanics,
Center for Mechanics and Materials,
Tsinghua University,
Beijing 100084, China
e-mail: mayinji@gmail.com

1Corresponding author.

Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received June 10, 2017; final manuscript received June 18, 2017; published online July 7, 2017. Editor: Yonggang Huang.

J. Appl. Mech 84(9), 094501 (Jul 07, 2017) (3 pages) Paper No: JAM-17-1309; doi: 10.1115/1.4037149 History: Received June 10, 2017; Revised June 18, 2017

The ribbons selectively bonded to a prestrained elastomeric substrate may buckle into three-dimensional (3D) microstructures after the prestrain release, leading to three possible deformation modes, global, local, and no buckling, depending on the adhesion between the ribbons and substrate. This note establishes analytically the critical length-to-thickness ratio of ribbons, above which the global buckling mode (preferred for mechanically guided 3D deterministic assembly) occurs without material failure.

Copyright © 2017 by ASME
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Grahic Jump Location
Fig. 1

(a) Schematic illustrations of the process for fabricating the self-assembly 3D microstructures. (b) Normalized (compressive) strain versus normalized work of adhesion to distinguish different buckling modes.

Grahic Jump Location
Fig. 2

The normalized critical length-to-thickness ratio of the ribbon 3L(2γ/E¯h)1/4/(2πh) versus the normalized failure strain of the ribbon material εfE¯h/(2γ). The shaded region represents global buckling without material failure.




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